NAZCA

About global climate action Close

Global Climate Action  

At the twenty-first session of the Conference of the Parties (COP 21) in Paris, it was agreed that mobilizing stronger and more ambitious climate action by all Parties and non-Party stakeholders is urgently required if the goals of the Paris Agreement are to be achieved.

In decision 1/CP.21, the commitments from all actors are recognized, including those launched through the Lima–Paris Action Agenda, as well as the urgent need to scale up the global response to climate change and support greater ambition from governments.

At COP 22 in Marrakech, a High-Level Event on Accelerating Climate Action was held to highlight outcomes from the Action Events throughout the conference and culminated with the launching of the Marrakech Partnership for Global Climate Action; a new framework to catalyse and support climate action.

NAZCA Tracking Climate Action

Search

Browse

Join

Register your commitments
107

Technology Hardware and Equipment

SELECT A COMPANY

Acer Inc.

Taiwan Province of China

Advantech Co, Ltd.

Taiwan Province of China

Alcatel - Lucent

France

Amphenol TCS

United States of America

Anritsu Corporation

Japan

Apple Inc.

United States of America

Areva

France

Arista Networks

United States of America

Asustek Computer Inc

Taiwan Province of China

AU Optronics

Taiwan Province of China

Azbil Corporation

Japan

Barco NV

Belgium

Bell Integration

United Kingdom of Great Britain and Northern Ireland

BlackBerry Limited

Canada

Brother Industries, Ltd.

Japan

Canon Inc.

Japan

Celestica Inc.

Canada

Chicony Electronics Co. Ltd

Taiwan Province of China

Chunghwa Picture Tubes Ltd

Taiwan Province of China

Cisco Systems, Inc.

United States of America

Compal Electronics

Taiwan Province of China

Corporation Solar Alliance

Ukraine

DAEDUCK ELECTRONICS CO., LTD.

Republic of Korea

Darfon Electronics Corp

Taiwan Province of China

Dell Inc.

United States of America

Delta Electronics

Taiwan Province of China

Domino Printing Sciences

United Kingdom of Great Britain and Northern Ireland

ECI Telecom

Israel

Elec & Eltek Co Ltd

Hong Kong, China

Electrocomponents

United Kingdom of Great Britain and Northern Ireland

EMC Corporation

United States of America

Ericsson

Sweden

Flextronics International

United States of America

Founder PCB

China

FujiFilm Holdings Corporation

Japan

GEW

Hong Kong, China

Gigabyte Technology

Taiwan Province of China

GOODWELL

China

Halma

United Kingdom of Great Britain and Northern Ireland

Hamamatsu Photonics K.K.

Japan

Hamilton Safe Company

United States of America

Hewlett Packard Enterprise

United States of America

Hewlett-Packard

United States of America

Hitachi High-Technologies Corporation

Japan

Hitachi, Ltd.

Japan

Hong Fujin Precision Industry (G-subgroup) Co., Ltd

China

HP Inc

United States of America

Huntkey

China

Ibiden Co., Ltd.

Japan

Ingenico

France

Innolux Corporation

Taiwan Province of China

Inventec Co Ltd

Taiwan Province of China

IRIS

China

Jabil Circuit, Inc.

United States of America

Japan Display Inc.

Japan

JDS Uniphase Corp.

United States of America

Joy Technology (Shenzen) Corp.

Taiwan Province of China

Juniper Networks, Inc.

United States of America

Kimball Electronics Group

United States of America

Konica Minolta, Inc.

Japan

Lenovo Group

China

LEOCO CORPORATION

China

Lexmark International, Inc.

United States of America

LG Display

Republic of Korea

LG Innotek

Republic of Korea

Lite-On Technology

Taiwan Province of China

Logitech International SA

Switzerland

Luxshare

China

Micro-Star International Co, Inc

Taiwan Province of China

Mitac International

Taiwan Province of China

Molex Incorporated

United States of America

Motorola Solutions

United States of America

Murata Mfg. Co.

Japan

NEC Corporation

Japan

Netafim

Israel

NetApp Inc.

United States of America

Nokia Group

Finland

OMRON Corporation

Japan

Osram

Germany

Oxford Instruments Plc

United Kingdom of Great Britain and Northern Ireland

Pace Plc

United Kingdom of Great Britain and Northern Ireland

Planson International

United States of America

PMC-Sierra, Inc.

United States of America

Premier Farnell

United Kingdom of Great Britain and Northern Ireland

Qisda

Taiwan Province of China

QUALCOMM Inc.

United States of America

Quanta Computer

Taiwan Province of China

QubeGB Ltd.

United Kingdom of Great Britain and Northern Ireland

Renishaw

United Kingdom of Great Britain and Northern Ireland

Reunert

South Africa

Ricoh Co., Ltd.

Japan

Samsung Electro-Mechanics Co., Ltd.

Republic of Korea

Samsung Electronics

Republic of Korea

Samsung SDI

Republic of Korea

SanDisk Corporation

United States of America

Sanyo Denki America Inc

United States of America

Seagate Technology LLC

United States of America

Seiko Epson Corporation

Japan

Taiyo Yuden Co., Ltd.

Japan

TDK Corporation

Japan

TE Connectivity

United States of America

TPK Holding Co., Ltd.

Taiwan Province of China

Trimble Navigation

United States of America

UDE Corp

China

Vaisala

Finland

Yaskawa Electric Corporation

Japan

Zhejiang Super Lighting Electric AP

China